Bonbons Nintendo Wii Gum
Ingredients
sugar 52.9% , BASE DE GOMME 23.5% , corn syrup 11.8% , dextrose 5.9% , corn starch 2.9% , arômes artificiels fruités 1.5% , E414 0.7% , soya lecithin 0.4% , E903 0.2% , E330 0.1% , E296 0.0% , E422 0.0% , Colour 0.0% , Colour 0.0% , E110 0.0% , E129 0.0% , E321 0.0%
Translated — no label transcribed in this language yet.
Product data from Open Food Facts (ODbL) — community-maintained, imperfect, fixable.