Dipping Wafers

Cookies & biscuits 0879826006219

Ingredients

sugar 56.3% , hydrogenated palm kernel oil 21.9% , whole milk powder 10.9% , demineralized whey 5.5% , skimmed milk powder 2.7% , soya lecithin 1.4% , salt 0.1% , vanilla extract 1.2%

Nutrition · per 100 g

Energy 600 kcal
Fat 40 g
Saturated fat 40 g
Trans fat 0 g
Cholesterol 0 mg
Carbs 53.3 g
Sugars 53.3 g
Fiber 0 g
Protein 6.7 g
Salt 0.25 g
Sodium 100 mg
Calcium 133 mg
Iron 0 mg
Vitamin A 0 µg
Vitamin C 0 mg

Product data from Open Food Facts (ODbL) — community-maintained, imperfect, fixable.

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